lead-free parts pb a LG4731-PF - 2007 16 - jan. LG4731-PF doc. no : qw0905- rev. : date : data sheet ligitek electronics co.,ltd. property of ligitek only cylindrical type led lamps
0.5 typ 1.5max 2.54typ 5.0 5.9 25.0min 1.0min 5.8 6.7 page 1/5 ligitek electronics co.,ltd. property of ligitek only part no. LG4731-PF package dimensions -30 0 30 75% 25%50% 25%0 50%100% 60 100% -60 75% note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation + -
565 ligitek electronics co.,ltd. property of ligitek only unit ma mw a ma g symbol absolute maximum ratings parameter absolute maximum ratings at ta=25 120 100 i fp pd 10 ir power dissipation peak forward current duty 1/10@10khz reverse current @5v forward current i f 30 page 2/5 -40 ~ +100 tstg storage temperature forward voltage @20ma(v) color typical electrical & optical characteristics (ta=25 ) luminous intensity @10ma(mcd) 8.0160 max.min. min. 4.5 2.6 30 1.7 emitted lens green green transparent gap LG4731-PF note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typ. peak wave length pnm spectral halfwidth nm viewing angle 2 1/2 (deg) part no material operating temperature -40 ~ +85 t opr part no. LG4731-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip fig.6 directive radiation 3/5 part no. LG4731-PF
60 seconds max page 4/5 ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 5 /sec max temp( c) 260 260 c3sec max 150 100 time(sec) 50 2 /sec max 25 0 0 preheat note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 120 dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) part no. LG4731-PF
5/5 page reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 test item operating life test test condition reliability test: high temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) ligitek electronics co.,ltd. property of ligitek only this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. description mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 thermal shock test solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles solderability test 1.t.sol=230 5 2.dwell time=5 1sec this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202:103b jis c 7021: b-11 high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs the purpose of this test is the resistance of the device under tropical for hours. part no. LG4731-PF
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